UMC 65 nm Process
   
 
UMC L65 Standard Performance Low-K Library
 

FSE0A_A_SH (1 Port SRAM)
FSE0A_A_SJ (Dual Port SRAM)
FSE0A_A_SY (1 Port Register File)
FSE0A_A_SZ (2 Port Register File)
FSE0A_A_SP (VIA ROM)

   
UMC L65 Low Leakage Low-K Library
 

FSE0K_A_SH (1 Port SRAM)
FSE0K_A_SJ (Dual Port SRAM)
FSE0K_A_SY (1 Port Register File)
FSE0K_A_SZ (2 Port Register File)
FSE0K_A_SP (VIA ROM)
FXPLL030HE0K

 
UMC L65 Standard Performance Low-K Library Features
 
UMC L65 Low Leakage Low-K Library Features
  FSE0K_A_SH (1 Port SRAM)
 
  • Synchronous read and write operations
  • Low leakage and AC powers
  • High density available at 1.2 V ± 10%
  • Supports one pair of redundant row for the repair function
  • Automatic power-down mechanism to eliminate the DC current
  • Clocked address inputs, CSB, WEB, and DI to RAM at the CK rising edge
  • Supports byte write and word write operations
  • Verilog/VHDL timing simulation model generator
  • PICE netlist generator
  • GDSII layout generator
  • Memaker preview UI
  • Supports the BIST code
  • Column MUX options for the best aspect ratio and speed selection
  • View Details
 
   
  FSE0K_A_SJ (Dual Port SRAM)
 
  • Synchronous read and write operations
  • Low leakage device-based design
  • Fully-customized layout density
  • Available at 1.2 V ± 10%
  • Automatic power-down mechanism to eliminate the DC current
  • Clocked address inputs and CSA(B)N to the RAM at the CKA(B) rising edge
  • Clocked WEA(B)N input pins to the RAM at the CKA(B) rising edge
  • Clocked DIA(B) input pins to the RAM at the CKA(B) rising edge
  • Supports byte write and word write operations
  • Verilog/VHDL timing/simulation model generator
  • SPICE netlist generator
  • GDSII layout database
  • Memaker preview UI Supports the BIST code
  • Column Mux options for the best aspect ratio
  • Minimum metal requirement: 6 metal layers
  • View Details
 
   
  FSE0K_A_SY (1 Port Register File)
 
  • Operating voltage range: 1.08 V ~ 1.32 V
  • Operating junction temperature range: -40 °C ~ 125 °C
  • Recommended Ambient temperature range: 0 °C ~ 85 °C
  • Minimum metal requirement: 6 metal layers
  • Supports synchronous read and write operations
  • Fully-customized layout density
  • Available at 1.2 V ± 10%
  • Automatic power-down mechanism to eliminate DC current
  • Clocked address inputs and CSB to RAM at the CK rising edge
  • Clocked WEB input pin to RAM at the CK rising edge
  • Clocked DI input pins to RAM at the CK rising edge
  • Byte write or word write operations available
  • Verilog/VHDL timing/simulation model generator
  • SPICE netlist generator
  • GDSII layout database
  • Memaker preview UI
  • Supports the BIST code
  • Column Mux options for the best aspect ratio
  • View Details
 
   
  FSE0K_A_SZ (2 Port Register File)
 
  • Synchronous read and write operations
  • Fully-customized layout density
  • Available at 1.2 V ± 10%
  • Automatic power-down mechanism to eliminate the DC current
  • Clocked address inputs and CSA(B)N to RAM at the CKA(B) rising edge
  • Clocked WEB input pins to RAM at the CKB rising edge
  • Clocked DI input pins to RAM at the CKB rising edge
  • Supports the byte write and word write operations
  • Verilog/VHDL timing simulation model generator
  • SPICE netlist generator
  • GDSII layout database
  • Memaker preview UI
  • Column MUX options for the best aspect ratio
  • View Details
 
   
  FSE0K_A_SP (VIA ROM)
 
  • Synchronous read operation
  • Fully customized layout density per customer’s configurations
  • Programmable Via1 code
  • High density available at 1.2 V ±10%
  • Automatic power-down mechanism to eliminate the DC current
  • Clocked address inputs and CS to ROM at the CK rising edge
  • Verilog/VHDL timing simulation model generator
  • SPICE netlist generator
  • GDSII layout database
  • Mameker preview UI
  • Supports BIST code
  • Multi-block options for the best aspect ratio
  • View Details